Intel platforms for mobile applications with special touch in sensors and MEMS components
Dr. Rajashree Baskaran, Intel
Date: Thursday, April 2, 2015
Place: EA 409 Seminar Room
In today’s mobile devices, the use of sensors and haptics has increased tremendously in the last few years. In this seminar, I would like to present some of the recent trends in use of MEMS and other microfabrication technologies to enable new usages in the mobile platforms- including phones, tablets and wearables. Also, the increasing automation and connectivity inside many other devices and objects, like appliances and cars opens up large markets for sensor usages. I will also highlight some of the opportunities that exists for new technologies to get adopted in the consumer electronics as well as other “Internet of Things” areas.
Rajashree ‘Raji’ Baskaran is a researcher and sensor technologist at Intel Corporation. She was at University of Washington from 2006-2009. Her area of research interests while at UW are in the area of template based massively parallel assembly of microelectronic chips. She works in the area of advanced ( 3+ generation ahead) interconnects and novel packaging technologies for microprocessors. She has been a regular invited member on the NSF SBIR review panel and reviewer of Institute of Physics’ Journal of Micromechanics and Microengineering since 2003. Raji
has a two Divisional Recognition Awards for her technical contributions to the Components Research Division and Assembly Technology Development division within Intel and has 9 patent applications pending. She is the author of more than 15 publications in the area of MEMS and advanced packaging and interconnects technologies. Raji Baskaran received her PhD at University of California, Santa Barbara (2003) and a M.S. from Cornell University (2000).