Bilkent University
Mechanical Engineering Department
TÜBİTAK 1001 (213M351)
Start Date: March 15th, 2015
Completion Date: December 15th, 2016
In this project, micro-groove heat pipes that can be used in cooling of the electronic equipments were fabricated and investigated through analytical and experimental techniques. A computational model was developed to model an integrated micro-grooved heat pipe architecture starting with the theoretical modeling of heat transfer and fluid flow problems occurred within the heat pipes. Following the 3D modeling, the micro-grooved heat pipes were fabricated and tested through an experimental setup which was developed as a part of the project. The heat pipes were tested for different filling ratio, different heat flux values, different groove sizes and different working fluids. Both metal heat pipes and silicon heat pipes were tested, the thermal performance of the heat pipes were characterized, and the optimum operating conditions were indicated.